Skip Navigation

This Article
Right arrow Full Text (PDF)
Right arrow Alert me when this article is cited
Right arrow Alert me if a correction is posted
Services
Right arrow Email this article to a friend
Right arrow Similar articles in this journal
Right arrow Alert me to new issues of the journal
Right arrow Add to My Personal Archive
Right arrow Download to citation manager
Right arrowRequest Permissions
Google Scholar
Right arrow Articles by Xie, G.
Right arrow Articles by Noda, T.
Right arrow Search for Related Content
PubMed
Right arrow Articles by Xie, G.
Right arrow Articles by Noda, T.
Social Bookmarking
Add to CiteULike   Add to Connotea   Add to Del.icio.us  
What's this?

Journal of Electron Microscopy 51:S149-S153 (2002)
© 2002 Oxford University Press

Full-length paper

Electron microscopic observation of interfaces of aluminium powder compacts prepared by spark plasma sintering

Guoqiang Xie1,*, Osamu Ohashi1, Minghui Song2, Kazutaka Mitsuishi2, Hidehiro Yasuda2, Kazuo Furuya2 and Tetsuji Noda2

1Graduate School of Science and Technology, Niigata University, Niigata 950-2181 and
2National Institute for Materials Science, 3-13 Sakura, Tsukuba 305-0003, Japan

To whom correspondence should be addressed. E-mail: xieg{at}gs.niigata-u.ac.jp

Aluminium (Al) powder compacts prepared with two kinds of sintering parameters in the spark plasma sintering process have similar density but there is a large difference in their electrical resistivity and tensile properties. The interfaces for the compacts with differing properties were investigated by means of scanning and high-resolution transmission electron microscopy. Two types of interfaces between the powder particles, with metal/metal grain bonding and metal/intermediate oxide film layer/metal grain bonding, were observed in compacts for the two sintering conditions. The properties of Al powder compacts were mainly attributed to the behaviour of oxide film between the particles. It was observed that in the compact containing many metal/metal grain bonding interfaces, the electrical resistivity was lower and the tensile properties were better.

Keywords     spark plasma sintering, Al powder compact, bonding interface, oxide film, SEM, HRTEM


Add to CiteULike CiteULike   Add to Connotea Connotea   Add to Del.icio.us Del.icio.us    What's this?




Disclaimer: Please note that abstracts for content published before 1996 were created through digital scanning and may therefore not exactly replicate the text of the original print issues. All efforts have been made to ensure accuracy, but the Publisher will not be held responsible for any remaining inaccuracies. If you require any further clarification, please contact our Customer Services Department.