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Journal of Electron Microscopy Advance Access originally published online on August 25, 2005
Journal of Electron Microscopy 2005 54(4):345-350; doi:10.1093/jmicro/dfi053
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© The Author 2005. Published by Oxford University Press on behalf of Japanese Society of Microscopy. All rights reserved. For permissions, please email: journals.permissions@oxfordjournals.org

Reference sample for the evaluation of SEM image resolution at a high magnification—nanometer-scale Au particles on an HOPG substrate

Shigeo Okayama*, Satoshi Haraichi and Hirofumi Matsuhata

Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki 305-8568, Japan

* To whom correspondence should be addressed. E-mail: s-okayama{at}aist.go.jp

A new sample preparation technique is proposed for evaluating image resolution in a high magnification range of SEM. The proposed reference samples are uniformly distributed nanometer-scale Au particles on HOPG substrate. The samples are fabricated using the conventional ion sputter coater. The grain size and granularity are controlled by reducing the sputter-induced damage in the top layers of HOPG. The sample heating prior to SEM imaging is essential to suppress beam induced contamination. The heating time and temperature are selected to inhibit large increases in the grain sizes of Au particles. The sputter coated Au particles on the freshly cleaved HOPG substrate are superior in the deviations of particle sizes to the vacuum evaporated Au particles on the plasma etched substrates. The granularity and homogeneous distribution of Au particles on HOPG are demonstrated at a magnification range of x180k to x800k. The average grain size of 3.2 nm and the standard deviation of 1.3 nm are obtained under the condition of an annealing temperature of 180°C for 7 min after sputter coating an average thickness of 0.7 nm.

Keywords     scanning electron microscopy, nanometer-scale particle, Au particle, HOPG, beam induced contamination

Received     14 December 2004, accepted 8 July 2005


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