Journal of Electron Microscopy 48(4): 407-415 (1999)
© 1999 Oxford University Press
Measurement of geometrical dimensions using scanning electron microscopy
Integrated Circuit Advanced Process Technology Department Toshiba Corp. 8, Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
In this paper, in-process measurement method of geometrical dimensions of fine patterns using the principle of stereoscopy and digital image processing techniques is presented. We have applied this measurement method to sub-micrometer patterns with variable shapes in fabrication steps. Then, we have verified that an accuracy of 0.063 µm and a repeatability of 0.14 µm in depth measurements of hole patterns with a sharp side wall angle, an accuracy of 0.75° and a repeatability of 0.53° in measurements of a taper angle of photoresist patterns were achieved.
Keywords geometrical dimension measurement, image processing, stereoscopy, SEM
Received 24 February 1998, accepted 11 March 1999